Published in
2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia), 2018
DOI: 10.23919/ipec.2018.8507408
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Impact of the Thermal-Interface-Material Thickness on IGBT Module Reliability in the Modular Multilevel Converter
Proceedings article published in 2018 by
Yi Zhang 
,
Huai Wang,
Zhongxu Wang,
Yongheng Yang,
Frede Blaabjerg
,
Huai Wang,
Zhongxu Wang,
Yongheng Yang,
Frede Blaabjerg
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