Published in
2018 IEEE 4th Southern Power Electronics Conference (SPEC)
DOI: 10.1109/spec.2018.8636024
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A Temperature-dependent Thermal Model of Silicon Carbide MOSFET Module for Long-term Reliability Assessment
Proceedings article published in 2018 by
Mengxing Chen,
Huai Wang,
Frede Blaabjerg,
Xiongfei Wang 
,
Donghua Pan
,
Donghua Pan
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